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74VHC273 Octal D-Type Flip-Flop
April 1994 Revised April 2005
74VHC273 Octal D-Type Flip-Flop
General Description
The VHC273 is an advanced high speed CMOS Octal D-type flip-flop fabricated with silicon gate CMOS technology. It achieves the high speed operation similar to equivalent Bipolar Schottky TTL while maintaining the CMOS low power dissipation. The register has a common buffered Clock (CP) which is fully edge-triggered. The state of each D input, one setup time before the LOW-to-HIGH clock transition, is transferred to the corresponding flip-flop's Q output. The Master Reset (MR) input will clear all flip-flops simultaneously. All outputs will be forced LOW independently of Clock or Data inputs by a LOW voltage level on the MR input. An input protection circuit insures that 0V to 7V can be applied to the inputs pins without regard to the supply voltage. This device can be used to interface 5V to 3V systems and two supply systems such as battery backup. This circuit prevents device destruction due to mismatched supply and input voltages.
Features
s High Speed: fMAX
165 MHz (typ) at VCC VNIL
5V 25qC
s Low power dissipation: ICC s High noise immunity: VNIH s Low noise: VOLP
4 PA (max) at TA
28% VCC (min)
s Power down protection is provided on all inputs
0.9V (max)
s Pin and function compatible with 74HC273 s Leadless DQFN Package
Ordering Code:
Order Number 74VHC273M 74VHC273SJ 74VHC273BQ (Preliminary) 74VHC273MTC 74VHC273N Package Number M20B M20D MLP020B (Preliminary) MTC20 N20A Package Description 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide Pb-Free 20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 4.5mm 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide 20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide
Surface mount packages are also available on Tape and Reel. Specify by appending the suffix letter "X" to the ordering code. Pb-Free package per JEDEC J-STD-020B.
(c) 2005 Fairchild Semiconductor Corporation
DS011670
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74VHC273
Logic Symbols
Connection Diagrams
Pin Assignments for PDIP, SOIC, SOP, and TSSOP
IEEE/IEC
Pad Assignments for DQFN
Pin Descriptions
Pin Names D0-D7 MR CP Q0-Q7 Description Data Inputs Master Reset Clock Pulse Input Data Outputs
Function Table
Inputs Operating Mode MR Reset (Clear) Load '1' Load '0'
H HIGH Voltage Level L LOW Voltage Level X Immaterial LOW-to-HIGH Transition
Outputs Dn X H L Qn L H L
CP
L H H

X
(Top Through View)
Logic Diagram
Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.
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74VHC273
Absolute Maximum Ratings(Note 1)
Supply Voltage (VCC ) DC Input Voltage (VIN) DC Output Voltage (VOUT) Input Diode Current (IIK) Output Diode Current (IOK) DC Output Current (IOUT) DC VCC /GND Current (ICC ) Storage Temperature (TSTG) Lead Temperature (TL) (Soldering, 10 seconds) 260qC
0.5V to 7.0V 0.5V to 7.0V 0.5V to VCC 0.5V 20 mA r20 mA r25 mA r75 mA 65qC to 150qC
Recommended Operating Conditions (Note 2)
Supply Voltage (VCC) Input Voltage (VIN) Output Voltage (VOUT) Operating Temperature (TOPR) Input Rise and Fall Time (tr, tf) VCC VCC 3.3V r 0.3V 5.0V r 0.5V 0 ns/V a 100 ns/V 0 ns/V a 20 ns/V 2.0V to 5.5V 0V to 5.5V 0V to VCC
40qC to 85qC
Note 1: Absolute Maximum Ratings are values beyond which the device may be damaged or have its useful life impaired. The databook specifications should be met, without exception, to ensure that the system design is reliable over its power supply, temperature, and output/input loading variables. Fairchild does not recommend operation outside databook specifications. Note 2: Unused inputs must be held HIGH or LOW. They may not float.
DC Electrical Characteristics
Symbol VIH VIL VOH Parameter HIGH Level Input Voltage LOW Level Input Voltage HIGH Level Output Voltage VCC (V) 2.0 3.0 5.5 2.0 3.0 5.5 2.0 3.0 4.5 3.0 4.5 VOL LOW Level Output Voltage 2.0 3.0 4.5 3.0 4.5 IIN ICC Input Leakage Current Quiescent Supply Current 0 5.5 5.5 1.9 2.9 4.4 2.58 3.94 0.0 0.0 0.0 0.1 0.1 0.1 0.36 0.36 2.0 3.0 4.5 Min 1.50 0.7 VCC 0.50 0.3 VCC 1.9 2.9 4.4 2.48 3.80 0.1 0.1 0.1 0.44 0.44 V IOL IOL VIN VIN 5.5V or GND VCC or GND 4 mA 8 mA V V VIN IOH IOH VIH IOL or VIL V TA 25qC Typ Max TA
40qC to 85qC
Max
Min 1.50 0.7 VCC
Units V
Conditions
0.50 0.3 VCC
V VIN VIH IOH or VIL
50 PA
4 mA 8 mA
50 PA
r0.1
4.0
r1.0
40.0
PA PA
Noise Characteristics
Symbol VOLP (Note 3) VOLV (Note 3) VIHD (Note 3) VILD (Note 3)
Note 3: Parameter guaranteed by design.
Parameter Quiet Output Maximum Dynamic VOL Quiet Output Minimum Dynamic VOL Minimum HIGH Level Dynamic Input Voltage Maximum LOW Level Dynamic Input Voltage
VCC (V) 5.0 5.0 5.0 5.0 Typ 0.6
TA
25qC Limits 0.9
Units V V V V CL CL CL CL
Conditions 50 pF 50 pF 50 pF 50 pF
0.6
0.9
3.5 1.5
3
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74VHC273
AC Electrical Characteristics
Symbol fMAX Parameter Maximum Clock Frequency 5.0 r 0.5 tPLH tPHL Propagation Delay Time (CK - Q) 5.0 r 0.5 tPHL Propagation Delay Time (MR - Q) 5.0 r 0.5 tOSLH tOSHL CIN CPD Output to Output Skew Input Capacitance Power Dissipation Capacitance
Note 4: Parameter guaranteed by design tOSLH |tPLHmax tPLHmin|; tOSHL |tPHLmax tPHLmin|.
VCC (V) 3.3 r 0.3 Min 75 50 120 80 3.3 r 0.3
TA
25qC Typ 120 75 165 110 8.7 11.2 5.8 7.3 8.9 11.4 5.2 6.7 13.6 17.1 9.0 11.0 13.6 17.1 8.5 10.5 1.5 1.0 4.0 31 10.0 Max
TA
40qC to 85qC
Max 65 45
Min
Units MHz MHz
Conditions CL CL CL CL CL CL CL CL CL CL CL CL (Note 4) VCC Open CL CL (Note 5) 15 pF 50 pF 15 pF 50 pF 15 pF 50 pF 15 pF 50 pF 15 pF 50 pF 15 pF 50 pF 50 pF 50 pF
100 70 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 16.0 19.5 10.5 12.5 16.0 19.5 10.0 12.0 1.5 1.0 10.0
ns ns ns ns ns pF pF
3.3 r 0.3
3.3 r 0.3 5.0 r 0.5
Note 5: CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained from the equation: ICC (opr.) C PD * VCC * fIN ICC/8 (per F/F). The total CPD when n pieces of the Flip-Flop operates can be calculated by the equation: CPD (total) 22 9n.
AC Operating Requirements
Symbol tW(L) tW(H) tW(L) tS tH Minimum Pulse Width (MR) Minimum Setup Time Minimum Hold Time Parameter Minimum Pulse Width (CK) VCC (V) (Note 6) 3.3 5.0 3.3 5.0 3.3 5.0 3.3 5.0 tREC Minimum Removal Time (MR) 3.3 5.0
Note 6: VCC is 3.3 r 0.3V or 5.0 r 0.5V
TA Typ
25qC
TA
40qC to 85qC
Units
Guaranteed Minimum 5.5 5.0 5.0 5.0 5.5 4.5 1.0 1.0 2.5 2.0 6.5 5.0 6.0 5.0 6.5 4.5 1.0 1.0 2.5 2.0
ns
ns ns ns
ns
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74VHC273
Tape and Reel Specification
Tape Format for DQFN Package Designator BQ Tape Section Leader (Start End) Carrier Trailer (Hub End) TAPE DIMENSIONS inches (millimeters) Number Cavities 125 (typ) 2500/3000 75 (typ) Cavity Status Empty Filled Empty Cover Tape Status Sealed Sealed Sealed
REEL DIMENSIONS inches (millimeters)
Tape Size 12 mm
A 13.0 (330)
B 0.059 (1.50)
C 0.512 (13.00)
D 0.795 (20.20)
N 7.008 (178)
W1 0.488 (12.4)
W2 0.724 (18.4)
5
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74VHC273
Physical Dimensions inches (millimeters) unless otherwise noted
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide Package Number M20B
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74VHC273
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide Package Number M20D
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74VHC273
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
Pb-Free 20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 4.5mm Package Number MLP020B (Preliminary)
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74VHC273
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Package Number MTC20
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74VHC273 Octal D-Type Flip-Flop
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide Package Number N20A
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. www.fairchildsemi.com 10 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. www.fairchildsemi.com

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